Performance and characteristics:
1. Simple structure, convenient to manufacture and maintain
2. Working stroke is small, opening and closing time is short.
3. Good sealing, small friction between the sealing surface, and long service life.
4. Good appearance, long service life and flexible switch ConveyanceÂ
5.CE, ISO9001 certificated
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Structural formation | Bolt-jointed bonnet outside stem yoke structure |
Driving manner | Hand-operated |
Design standard | ASME B16.34/BS1873 |
Face to face | ASME B16.10 |
Flanged ends | ASME B16.5 |
Test &inspection | API598 |
No. Accessory Name |
Material | Â |
1- Body | ASTM A216-WCB ASTMA217-WC1,WC6,WC9,C5 ASTM A351-CF8/CF8M/CF8C/CF3/CF3M |
|
2-Nut | ASTM A194-2H,A194-8,A194-8M | |
3-Bonnet | ASTM A216-WCB ASTMA217-WC1,WC6,WC9,C5 ASTM A351-CF8/CF8M/CF8C/CF3/CF3M |
|
4-Disc | ASTM A182Gr.F6a/ ASTM A182F22 ASTMA182-F304/F316/F321/F304L/F316L |
|
5-Gasket | Graphite+Stainless Steel | |
6-Stud | ASTM A193-B7,A320-B8,A193-B8M | |
7-Flat cover | ASTM A182Gr.F6a/ ASTM A182F22 ASTMA182-F304/F316/F321/F304L/F316L |
|
8-Stem | ASTM A182Gr.F6a/ ASTM A182F22 ASTMA182-F304/F316/F321/F304L/F316L |
|
9-Packing | Graphite | |
10-Packing press-sleeve | ASTM A182Gr.F6a/ ASTM A182F22 ASTMA182-F304/F316/F321/F304L/F316L |
|
11-Packing gland | ASTM A216-WCB ASTM A351-CF8/CF8M/CF8C/CF3/CF3M |
|
12-Valve stem nut | Copper alloy | |
13-Handwheel | ASTM A47-32510 |
Panasonic provides extremely dependable electronics assembly equipment in the areas of SMT (surface mount technology), PTH (pin through-hole), and processes involving microelectronics back-end packaging of any-mix circuit manufacturing. We offer first-class equipment ranging from screen printers and dispensing, through component placement and inspection, up to axial and radial insertion, die bonding, die attach and flip chip. Our equipment is used all around the world to enable the production of the most modern technology.
Our variable machines in modular format support a large range of technologies and, from the installation of just one machine through to assemblies of over 1,000, can take care of processes such as, COB (chip on board), SOP (system on package), epoxy die attach, POP (package on package), 3D packaging, TS (thermo-sonic) and TC (thermo-compression) processing, plasma RIE surface cleaning, plasma ICP etching, and thin wafer plasma dicing. To perform odd-form placement and end-of-line work, we also offer automated equipment.
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Shenzhen Keith Electronic Equipment Co., Ltd. , https://www.aismtks.com