The new high-speed SiC714CD10 and SiC711CD10 converters are designed to simplify power design with their advanced integration. These devices combine control MOSFETs, synchronous MOSFETs, and driver circuitry into a compact PowerPAK MLF 10x10 package, offering an ultra-thin and high-performance solution. By integrating all essential components into one package, they significantly reduce the complexity of single-phase and multi-phase DC-to-DC converter designs, while improving efficiency by up to 3% compared to traditional discrete solutions.
Targeted for use in servers, routers, point-of-load (POL) converters, and intermediate bus architectures operating at 3.3V, 5V, and 12V, these converters help save valuable board space and reduce power consumption. Their small footprint allows for higher power density, making them ideal for space-constrained applications. The integrated MOSFET and driver also help minimize parasitic leakage, which can lead to unwanted ringing and voltage peaks at the switching node, ensuring more stable and reliable performance.
These ICs are compatible with any PWM IC or ASIC, enabling the creation of efficient buck converter circuits. A key feature is the low-side MOSFET control pin, which supports pre-biased startup, preventing potentially damaging currents from flowing during the initial charging of output capacitors—especially important in sensitive POL and server environments.
The SiC714CD10 operates within a 3.3V to 16V input range and delivers 27A of continuous output current in still air, optimized for a 10% duty cycle. It features a low-side MOSFET with a typical on-resistance of 3mΩ and a high-side MOSFET with 10.2mΩ. Meanwhile, the SiC711CD10, also supporting a 3.3V to 16V input range but with a 40% duty cycle, provides up to 25A of continuous output current, with both high- and low-side MOSFETs exhibiting a typical on-resistance of 4mΩ.
Both devices are specifically optimized for 12V-to-logic-level conversion and support switching frequencies ranging from 100kHz to over 1MHz. Their PowerPAK MLF 10x10 package not only offers low thermal resistance for better heat dissipation but also features a simple pad layout that simplifies PCB design and assembly, making it easier for engineers to implement in real-world applications.
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